Customized Solutions for the Semiconductor IndustryLAPMASTER WOLTERS is a well-known and reliable partner for semiconductor customers in the field of silicon wafer and LED wafer processing. LAPMASTER WOLTERS provides customized precision surface processing technology solutions for wafers and substrates, serving materials such as silicon, sapphire, gallium arsenide, and silicon carbide used in the manufacturing of microelectronic, micro-optical, and micromechanical devices.Our lapping, fine grinding, and polishing machines deliver leading advantages in both local and overall geometry of workpieces after processing. "Made by LAPMASTER WOLTERS" signifies the highest quality in the international machine tool market.From Wafers to Wafers – The LAPMASTER WOLTERS AC 2000The third-generation microLine© AC 2000 from LAPMASTER WOLTERS offers double-side lapping and polishing solutions for wafer processing with diameters ranging from 200 mm (8") to 450 mm (18").This unique equipment concept makes the AC 2000 the most flexible device to support all future wafer processing needs.We continuously set benchmarks for precision, quality, efficiency, and operating costs.First-Class Customer Support and Consumables SupplyLAPMASTER WOLTERS provides first-class support throughout the entire equipment lifecycle, enabling customers to achieve maximum equipment utilization and production efficiency. Globally located technicians and professional after-sales service teams offer processing, planning, and safety services.Customers have a wide range of consumables to choose from, including diamond lapping pads, diamond fine grinding discs, dressing tools, polishing pads, polishing slurries, workpiece fixtures, and complete accessories.The large contact area between the wafer and the grinding surface reduces local stress and achieves uniform grinding marks, avoiding the central tool marks caused by traditional cup wheels. After PPG processing, both local and overall wafer flatness are improved, and subsurface damage is reduced, so the processing time required by this equipment is less compared with traditional lapping or fine grinding.The shared tool platform for PPG and DSP can reduce operator training and maintenance costs.