Lapmaster has developed a chamfering machine specifically for chamfering glass products, capable of processing one edge at a time.
The DSM 16B double-side processing system is a high-precision solution for finish or semi-finish machining, capable of simultaneously lapping, fine grinding, diamond polishing, or soft polishing both
The DSM 9B double-side processing system is a high-precision solution for finish or semi-finish machining, capable of simultaneously lapping, fine grinding, diamond polishing, or soft polishing both s
The DSM 20B double-side processing system is a high-precision solution for finish or semi-finish machining, capable of simultaneously lapping, fine grinding, diamond polishing, or soft polishing both
The CL2000 is a compact, multi-functional benchtop device, ideal for small workshops and laboratories. Designed based on the 2-way planetary concept, the Lapmaster Wolters double-side lapping/polishin
LAPMASTER WOLTERS has invested in the further development of Abrasive Flow Machining (AFM) and Free Form Honing (FFH).
LAPMASTER WOLTERS has invested in the further development of Abrasive Flow Machining (AFM) and Free Form Honing (FFH).FFH processing uses abrasives uniformly dispersed in a putty-like substance. This
Workpiece size: Maximum diameter 8 inches × 420 mm·Optimized slurry cutting fluid management·Recognized as the best-in-class for silicon carbide (SiC) and 8-inch semiconductor industries
Maximum workpiece size: 6 inches × 650 mm.Optimized design for mass production of 6-inch wafers