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chamfering machine
chamfering machine

Lapmaster has developed a chamfering machine specifically for chamfering glass products, capable of processing one edge at a time.

DSM_16B
DSM_16B

The DSM 16B double-side processing system is a high-precision solution for finish or semi-finish machining, capable of simultaneously lapping, fine grinding, diamond polishing, or soft polishing both

DSM_9B
DSM_9B

The DSM 9B double-side processing system is a high-precision solution for finish or semi-finish machining, capable of simultaneously lapping, fine grinding, diamond polishing, or soft polishing both s

DSM_20B
DSM_20B

The DSM 20B double-side processing system is a high-precision solution for finish or semi-finish machining, capable of simultaneously lapping, fine grinding, diamond polishing, or soft polishing both

CL2000
CL2000

The CL2000 is a compact, multi-functional benchtop device, ideal for small workshops and laboratories. Designed based on the 2-way planetary concept, the Lapmaster Wolters double-side lapping/polishin

AFM-FFH-10-6
AFM-FFH-10-6

LAPMASTER WOLTERS has invested in the further development of Abrasive Flow Machining (AFM) and Free Form Honing (FFH).

AFM-FFH-3-4
AFM-FFH-3-4

LAPMASTER WOLTERS has invested in the further development of Abrasive Flow Machining (AFM) and Free Form Honing (FFH).FFH processing uses abrasives uniformly dispersed in a putty-like substance. This

DW288-S4
DW288-S4

Workpiece size: Maximum diameter 8 inches × 420 mm·Optimized slurry cutting fluid management·Recognized as the best-in-class for silicon carbide (SiC) and 8-inch semiconductor industries

DW 288 S6
DW 288 S6

Maximum workpiece size: 6 inches × 650 mm.Optimized design for mass production of 6-inch wafers