- No. 18, Pawei'er Road, Jiangning District
Workpiece size: Maximum diameter 8 inches × 420 mm
·Optimized slurry cutting fluid management
·Recognized as the best-in-class for silicon carbide (SiC) and 8-inch semiconductor industries
·Suitable for diverse applications with different specifications
The SS-15H Bench-Top Lapping Machine, manufactured by the Lapmaster Wolters Group, is an ideal choice for processing workpieces requiring extremely high flatness and surface finish standards.
Maximum workpiece size: 6 inches × 650 mm.Optimized design for mass production of 6-inch wafers
Double-Side Batch Machining Equipment.It can handle workpieces with a maximum diameter of 260mm and a thickness of 50mm.Designed for high-precision machining of workpieces, it is suitable for lapping
The length of the workpiece that can be ground starts from 1 meter and can reach up to 6 meters. Model diversity: SLM 2002\SLM4002\SLM6002. It can be configured with either 2 grinding heads structure
The PETER WOLTERS AC 535 Double-Side Batch Machining Equipment is designed for processing high-precision series workpieces. Featuring a modular design, it can be used as a fine grinder, lapper, honing
The LAPMASTER WOLTERS AC 700 Double-Side Machining Equipment is designed for batch finishing of workpieces. Featuring a modular design, the AC 700 can be used for precision grinding, lapping, and poli
The M9 is a standard 5-axis grinding machine, with a maximum configuration of 6 axes. It supports grinding, milling, drilling, measuring, and is equipped with an automatic tool changer.Its dynamic acc
The multi-spindle rotary headstock can accommodate up to 4 different types of spindles on the same turret, meeting high coaxiality and high cylindricity requirements. The turret drive can be adapted t
Workpiece size: Maximum diameter 8 inches × 420 mm·Optimized slurry cutting fluid management·Recognized as the best-in-class for silicon carbide (SiC) and 8-inch semiconductor industries
